產品介紹
陶瓷散熱基板 薄膜製程
SoarTech provides total solutions of laser processing for ceramic substrate, including laser scribing, laser drilling holes, and laser cutting services.
Laser Scribing
- Minimum scribing diameter
- Green Laser : 25~30μm
- UV Laser : 12~16μm
- Tolerance : ± 5μm
Laser Drilling Holes
- Minimum drilling diameter : 50μm
- Tolerance : 50μm ± 10μm
- Taper precision : 90°± 10°
- Minimum hole to hole distance : ≧ 1/2 thickness of substrate
- Maximum drilling thickness : 1.0mm
Laser Cutting
- Minimum drilling diameter : 50μm
- Tolerance : 50μm ± 10μm
- Maximum drilling thickness : 1.0mm
Tel: +886 2 8792-1266
Fax: +886 2 8792-1266
Address: 9F., No. 136, Sec. 2, Keelung Rd., Da’an Dist., Taipei City 106, Taiwan (R.O.C.)
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